Topic of your interest
In addition to conventional smart cards, a new class of so-called multifunctional cards is becoming increasingly important and is about to be launched on the market. These are smart cards that are not just limited to a chip and its functions, but have additional SUIs (Smartcard User Interfaces) integrated, e.g. displays or biometric sensors.
However, due to a lack of experience with the new card technology, particularly in the area of exposure to electrostatic discharge (ESD), the market launch of multifunction cards also harbors major risks.
Due to the ongoing miniaturization of semiconductor components, which are also installed in SUIs, ESD problems continue to increase and influence production yields and quality. However, there are currently no adequate test methods for testing the robustness of multifunction cards against electrostatic discharge. This research project aims to close this gap.
Solution steps
In order to be able to test the resistance of multifunctional cards to electrostatic discharge, the first step is to develop realistic test methods. The starting point for this is the current ESD test methods for conventional chip cards. By systematically varying the test parameters and modifying the existing test setups, ESD test procedures adapted to multifunctional cards are to be developed. In the final step, the robustness of SUIs against electrostatic discharge can be tested and evaluated.
Targeted results
Especially against the background of the market launch of a new technology, it is very important for SMEs in particular to know the risks of product failure and to take remedial action if necessary. This is precisely where this research project comes in. The test method to be developed should enable companies to test and evaluate the functional stability of smart cards with SUIs against electrostatic discharge.